Bond 2.1 is a 5th generation, light-cured dental adhesive that simplifies clinical procedures by combining the primer and bonding agent into a single bottle. It is designed to fill surface irregularities, creating a strong micro-mechanical bond between dental enamel/dentin and materials such as composite resins and resinous cements.It uses an ethanol-based solvent, which is less volatile than acetone, allowing for a more stable and less technique-sensitive application.
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Features
High Bond Strength: Engineered to provide excellent adhesion forces to both enamel and dentin.
Versatile Indications: Indicated for direct light-curing resin restorations, indirect restorations (inlays, onlays, laminates), and restorations using intra-radicular retainers when paired with resin cement.
Surface Compatibility: Effective for use on various surfaces including dental enamel, cohesive gold, amalgam, and acrylic resin.
Effective Polymerization: Requires only 20 seconds of light curing to achieve a stable set.
Visual Confirmation: A properly applied and cured layer will appear shiny and smooth on the surface; if not, a second layer can be easily reapplied.